Breaking News ! Dinghui Microelectronics Won the Forth IC Technology Innovation Award!
2021/03/20
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On March 20, IC Industry Chain Collaborative Innovation Exchanging Meeting and China Integrated Circuit Innovation Alliance Assembly was held simultaneously in Beijing and Shanghai.The conference specially commended the companies that have made major breakthroughs in technological innovation and the industrialization of achievements in the field of integrated circuits.
Hubei Dinghui Microelectronics Materials Co., Ltd. won the "Technology Innovation Award" for the "12-inch wafer CMP oxide polishing pad for integrated circuits" project.
