The Materials and Components Alliance successfully held the "Integrated Circuit Chip Manufacturing Process and Integration Techn

On October 25, 2016, the Strategic Innovation Alliance for Integrated Circuit Materials and Components Industry (hereinafter referred to as the “Materials and Components Alliance”) successfully held the “Integrated Circuit Chip Manufacturing Process and Integration Technology” course training in Qingdao. The meeting invited a member of the Expert Advisory Committee of the Materials and Components Alliance and Dr. Lin Qinghuang, a researcher at the IBMT.J. Watson Institute in the United States. Dr. Lin has 10 years of experience teaching this course in the United States. The meeting attracted more than 20 representatives to participate. In his opening speech, Secretary-General Shi Lang emphasized the importance of this course and fully affirmed everyone's strong enthusiasm for learning.

 

The chip manufacturing process is the core technology of the integrated circuit industry. Advanced chip manufacturing consists of a front-end process (FEOL), a middle process (MOL), and a downstream process (BEOL). These three processes constitute the entire manufacturing process of modern VLSI chips. Before the course began, Dr. Lin collected the knowledge points that the students hoped to learn through this course. During the course of the lecture, Dr. Lin focused on the unique technical challenges in the three processes of advanced chip manufacturing and discussed potential solutions, use technologies and success stories. At the same time, he also introduced new materials (such as High-K dielectric/metal gate (HKMG), III-V materials), new devices and interconnect structures (such as FinFET/three-gate, nanowire, copper/air gap interconnect) and new integrated processes (eg 3D integrated circuits, SiTI) Holes) and recent technological innovations in lithography processes (such as double exposure and directed self-assembly). In the classroom test, everyone discussed in groups and shared different opinions. At the end of the course, Dr. Lin reviewed and compared the needs of the students before the start of the course, and said that the knowledge points raised by the students but not covered in the course will be communicated through other means after class.

 

After the training class, everyone expressed their deep gains: by participating in this training class, they learned about the process of connecting the process before and after the chip manufacturing process, and had a clear understanding of the company's new product development direction under the new technology change. Organize such technical training sessions.

 

The participants in the training meeting are: Anji Microelectronics, Research Institute Yijin, Suzhou Karma, Guangdong Huate Gas, Shenzhen Haoyang, Zhejiang Borui, Green Ling Gas, Hubei Xingfu, Shanghai Institute of Microsystems, Chinese Academy of Sciences, etc. .