Product features: Copper polishing liquid: high grinding rate (0.5-1 μ M / min), high dilution ratio (> = 10x) barrier layer polishing liquid: high grinding rate (0.1 μ M / min), adjustable selection ratioAnji Microelectronics (Shanghai) Co., Ltd
Product features: rough polishing liquid: high grinding rate (1-2 μ M / min), high dilution ratio (1:20-1:40); fine polishing liquid: ultra-low surface defects, ultra-low surface roughness, high dilution ratio (1:10-1:20)Anji Microelectronics (Shanghai) Co., Ltd
Product features: a full range of silica particles selection (sintered and colloidal), defect enhancementAnji Microelectronics (Shanghai) Co., Ltd
Product features: high grinding rate (> 0.6 μ M / min), diluble (> = 4x), high o / N selection ratio (> = 150)Anji Microelectronics (Shanghai) Co., Ltd