In view of the increasing application of chemical mechanical planarization (CMP) technology in semiconductor processes and ultra-precision fabrication, the importance of CMP processes has become more prominent as semiconductor feature line widths have further narrowed and ultra-precision processing techniques have evolved. And facing the multiple technical challenges of process technology, key equipment and process materials, the development of industrial technology calls for the close cooperation of the entire industry chain of technology, equipment and materials. On the other hand, the International Conference on Planarization Technology (ICPT) is also working with major countries and regions of the CMP Users Group to promote CMP technology exchange and promotion applications around the world. In order to promote the development of China's CMP technology and dock with the international ICPT institutions, the China Semiconductor Industry Association, the China Mechanical Engineering Society, Micro-Nano Manufacturing Tribology Professional Committee, and the Integrated Circuit Materials Industry Technology Innovation Strategic Alliance jointly launched, focusing on flattening technology. Family enterprises, institutions, universities, and research institutes have voluntarily established the "flattening technology alliance" (hereinafter referred to as "the alliance").