Sulfuric acid (H2SO4, 96% concentration)
basic information
It can be used to remove metal and organic matter on the surface of silicon wafer, and also can be used for wet etching and final degumming in photolithography. metal ion <50ppt,particle:0.5um<10、0.3um<20、0.2um<100。
Hubei Xingfu Electronic Materials Co., Ltd
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H3PO4
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Aluminum etching solution