中文版 | English

Sulfuric acid (H2SO4, 96% concentration)

basic information
没有此类产品
Detail

It can be used to remove metal and organic matter on the surface of silicon wafer, and also can be used for wet etching and final degumming in photolithography. metal ion <50ppt,particle:0.5um<10、0.3um<20、0.2um<100。

Hubei Xingfu Electronic Materials Co., Ltd

On a
H3PO4
The next article
Aluminum etching solution