The IC Ultra-Clean Process Technology Workshop was Successfully Held

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As the semiconductor process node continues to evolve, the cleanliness requirements of the wafer surface are becoming more and more stringent. Micro-polluting impurities on the wafer surface are a key factor affecting chip yield and chip product performance. In order to cope with the new challenges and new demands for micro-pollution control raised by high-end processes, on November 19, the Integrated Circuit Material Industry Technology Innovation Alliance (hereinafter referred to as "Materials Alliance") and Cobetter Filter Equipment Co., Ltd. (hereinafter referred to as "Technology "Baxter") the integrated circuit ultra-clean process technology workshop was successfully held in Xiaoshan District, Hangzhou.