From July 8th to 11th, 2021, "China Materials Conference 2021" was held in Xiamen International Convention and Exhibition Center, Fujian Province. The conference has set up 51 branches and 3 sub-forums, covering the cutting-edge research fields of energy materials, environmental materials, semiconductor materials, superconducting materials, polymer materials, high-performance fibers and their composite materials, high-temperature alloys, superhard materials, biomedical materials, smart materials, etc. During the event, around 12,000 people attended the conference.

Organized by the Integrated Circuit Materials Industry Technology Innovation Alliance, and under the jointly support of the Shanghai Institute of Microsystems and Information Technology of the Chinese Academy of Sciences and the Beijing Multidimensional Electronic Materials Technology Development and Promotion Center, the "Advanced Microelectronics and Optoelectronic Materials Sub-Meeting" was held concurrently. Xi Wang, the Deputy Governor of the People's Government of Guangdong Province, served as the chairman of the "Advanced Microelectronics and Optoelectronic Materials Sub-Meeting". Academician Zhengping Wang of the Chinese University of Hong Kong was honorary chairman, and Academician Deren Yang of Zhejiang University, Chao Zhao, Institute of Microelectronics of Chinese Academy of Sciences, and Dr. Qinghuang Lin of ASML, jointly served as vice-chairmen. Mr. Chao Zhao, on behalf of Academician Xi Wang, gave an opening speech at the branch meeting. This "Advanced Microelectronics and Optoelectronic Materials Sub-meeting" has a total of 1 keynote speech, 13 invited reports, 17 oral reports, 19 posters, and more than 80 participants. The report covers the fields of microelectronics and optoelectronic materials, including: new storage materials such as MRAM, FRAM, PCRAM and RRAM; substrate materials such as Ge, Si, SOI, GOI and compound semiconductors; new display materials and other materials used in the manufacture of integrated circuits and optoelectronic devices; advanced packaging Materials; carbon-based functional materials such as carbon nanotubes and graphene; new two-dimensional materials such as CN3; material detection technology and methods; material design theory and calculation simulation, etc.